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Global Scans · Huawei · Weekly Summary


  • [New] The Chinese vendor ecosystem, including Xiaomi, Huawei, Alibaba, and RayNeo among a growing cast of others, will apply sustained pressure on pricing and volume, particularly in Asia-Pacific markets. IDC
  • Huawei has said it expects to design competitive chips by 2031, and SMIC is reportedly producing 7-nanometer parts for Huawei's current Ascend AI accelerators. Tech Startups - Tech News, Tech Trends & Startup Fundin
  • Huawei says it will use its new approach to produce components with performance equivalent to a 1.4-nanometer chipmaking process by 2031. Wired
  • Open Radio Access Networks is a technology that holds the potential to bring further competition to areas where Huawei and ZTE have been traditionally dominant. Roza.Pace@trade.gov
  • By focusing on RF modules, Huawei offers a chance to consider what areas require its attention to build the essential technologies, designs, and intellectual property (IP), which may be expected to generate to design of a whole integrated module system in China. Precedence Research
  • Failing to export American AI while China ramps up capacity to eventually serve third markets risks repeating the mistake of 5G, where the United States pioneered the underlying technology but ceded global deployment to Huawei. CNAS
  • DeepSeek V4 - Pro runs on Huawei Ascend 950 clusters launching in H2 2026, at which point pricing is expected to drop further. AI to ROI - By Ray Rike and Peter Buchanan
  • DeepSeek's prices could get even cheaper: It expects to lower V4 - Pro prices later in the year as Huawei scales up production of its new Ascend 950 AI processors. Fortune
  • At least two non-Chinese countries will sign major Huawei AI infrastructure deals by mid-2027. Tech Insider

Last updated: 28 June 2026



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